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Wafer Cutter and Laminator

The wafer cutter and laminator can automatically cut the laminated wafer biscuits into desired size.

Technical Parameters
1. Material: The machine frame is made of GB steel, and 304 stainless steel is adopted by the shell.
2. Motor: SEW, Germany
3. PLC: Siemens, Germany
4. Switch: Schneider
5. Size (L×W×H): 1545×2100×1100mm
6. Power: 0.75kW

Related Names
Waffle Sheet Cutting Facility | Wafer Slicing Machine | Waffle Dividing Equipment | Wafer Separating Device

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