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Wafer Cutting Machine

This wafer cutting machine can laminate the cream-filled wafer sheet, and then cut it into strips with desired size.

Technical Parameters
1. Materials: GB steel and 304 stainless steel are used to make the frame and shell, respectively.
2. Cutting height: 20mm-55mm
3. Motor: SEW, Germany
4. PLC: Siemens, Germany
5. Switch: Schneider, Germany
6. Size (L×W×H): 1545×2100×1100mm
7. Power: 0.93kW

Related Names
Waffle Sheet Arranging Cutting Facility | Wafer Reorganizing Slicing Machine | Waffle Placed Dividing Equipment | Wafer Collecting and Separating Device

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