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Wafer Cutting Machine

This wafer cutting machine is designed to automatically cut the laminated wafer sheet.

Technical Parameters
1. Materials: The machine frame and shell are produced using GB steel and 304 stainless steel, respectively.
2. Motor: SEW, Germany
3. PLC: Siemens, Germany
4. Switch: Schneider, Germany
5. Size (L×W×H): 1530×2100×1100mm
6. Power: 0.75kW
7. Blade: Rotary saw blade

Related Names
Waffle Sheet Cutting Facility | Wafer Slicing Machine | Waffle Dividing Equipment | Wafer Separating Device

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