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Wafer Cutting Machine

The wafer changes its moving direction from horizontal to vertical, and moves into the cutting channel. Then, the cylinder drives and raises the holding plate to stop the transportation of wafer, after the wafer stops at a proper position, the cutting blade is driven by the cylinder to cut the ball-shaped wafer in halves.

Technical Parameters
1. Material: The shell is made of 304 stainless steel.
2. Motor: SEW, Germany
3. Size (L×W×H): 1500×620×820mm
4. Power: 0.18kW

Related Names
Waffle Cutting Facility | Wafer Slicing Machine | Waffle Dividing Equipment | Wafer Separating Device

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