This cooling machine has a triangular shape, and it is used to carry wafer sheet. During transportation, the wafer is naturally cooled by air to lower the temperature, which prevents the biscuit from too crisp. As a result, the biscuit will not crack which is lead by pressing and collision during laminating process, and the product quality is guaranteed.
1. Materials: The raw materials for frame and shell are GB steel bar and 304 stainless steel, respectively.
2. Motor: SEW, Germany
3. Size (L×W×H): 1300×500×1300mm
4. Power: 0.8kW
Waffle Cooler | Wafer Temperature Dropping Machine | Waffle Cooling Facility | Wafer Heat Decreasing Device